Interface microstructure and mechanical properties of copper/aluminum composite material

Paper


Yu, Bao Yi, Wang, Qing, Li, Qiang, Wu, Yu Juan and Chen, Yan. 2013. "Interface microstructure and mechanical properties of copper/aluminum composite material ." Sang, Xiaoming and Kim, Yun-Hae (ed.) 3rd International Conference on Advanced Engineering Materials and Technology (AEMT 2013). Zhangjiajie, China 11 - 12 May 2013 Zurich, Switzerland. https://doi.org/10.4028/www.scientific.net/AMR.753-755.207
Paper/Presentation Title

Interface microstructure and mechanical properties of copper/aluminum composite material

Presentation TypePaper
AuthorsYu, Bao Yi (Author), Wang, Qing (Author), Li, Qiang (Author), Wu, Yu Juan (Author) and Chen, Yan (Author)
EditorsSang, Xiaoming and Kim, Yun-Hae
Journal or Proceedings TitleAdvanced Materials Research
Journal Citation753-755, pp. 207-214
Number of Pages8
Year2013
Place of PublicationZurich, Switzerland
ISSN1022-6680
1662-8985
ISBN9783037857649
Digital Object Identifier (DOI)https://doi.org/10.4028/www.scientific.net/AMR.753-755.207
Conference/Event3rd International Conference on Advanced Engineering Materials and Technology (AEMT 2013)
Event Details
3rd International Conference on Advanced Engineering Materials and Technology (AEMT 2013)
Event Date
11 to end of 12 May 2013
Event Location
Zhangjiajie, China
Abstract

The composite was produced by pouring melt Al into solid Cu pipe. Microstructure, mechanical properties and Cu-Al composition distribution in Cu/Al composite interface were studied in the paper. The experimental results show that Cu and Al diffuse to each other, which the Cu/Al interface zone is formed. Moreover, there are lots of Cu-Al phase appearing in the Cu/Al interface zone. Furthermore, the influences of annealing temperature on the peal strength of Cu/Al interface were tested, in which the peel strength of the Cu/Al interface zone reaches the highest point to 15 MPa at 350°C and then decreases with the annealing temperature increases. In addition, the width of the diffusing layer and the average grain size of the Cu/Al interface zone increase with the annealing temperature increases.

KeywordsCu/Al composite; interface; microstructure; peel strength
ANZSRC Field of Research 2020340399. Macromolecular and materials chemistry not elsewhere classified
401607. Metals and alloy materials
401706. Numerical modelling and mechanical characterisation
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Byline AffiliationsShenyang University of Technology, China
Department of Mechanical and Mechatronic Engineering
Shanghai Jiao Tong University, China
Institution of OriginUniversity of Southern Queensland
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