Finite Element Modeling for Thermal Conductivity of Cement-based Encapsulation Materials
Paper
Paper/Presentation Title | Finite Element Modeling for Thermal Conductivity of Cement-based Encapsulation Materials |
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Presentation Type | Paper |
Authors | Gao, Hanyan, Zhang, Jing, Zhu, Yingcan, Guo, Ruiqian, Zhang, Wanlu, Zhang, Guoqi and Liu, Pan |
Journal or Proceedings Title | Proceedings of 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) |
Number of Pages | 5 |
Year | 2022 |
Publisher | IEEE (Institute of Electrical and Electronics Engineers) |
Place of Publication | China |
ISBN | 9781665499057 |
Digital Object Identifier (DOI) | https://doi.org/10.1109/ICEPT56209.2022.9873392 |
Web Address (URL) of Paper | https://ieeexplore.ieee.org/document/9873392 |
Web Address (URL) of Conference Proceedings | https://ieeexplore.ieee.org/xpl/conhome/9872527/proceeding |
Conference/Event | 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) |
Event Details | 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Parent International Conference on Electronics Packaging Technology (ICEPT) Delivery In person Event Date 10 to end of 13 Aug 2022 Event Location Dalian, China |
Abstract | With the trend of miniaturization and the increasing power density, the operating temperature of electronic devices keeps climbing, especially for wide band-gap semiconductors such as silicon carbide and gallium nitride. The high operating temperature up to 250 brings challenges to encapsulation materials since traditional encapsulation materials such as epoxy resins and silicone gels hardly bear temperatures above 200. Calcium aluminate cement (CAC) was proved to be a promising encapsulation material, which owns high thermal stability with its operating temperature of up to 300. Based on its satisfied thermal stability and low cost, the thermal conductivity of CAC was researched in this work with different ratios of 10-μm-sphere-Alumina (Al2O3) fillers at different temperatures, which formed μm-scale CAC-Al2O3 composites. In this work, we focused on the thermal conductivity of CAC-Al2O3 composites aiming for encapsulation applications in power electronics packaging. The thermal conductivities of μm-scale CAC-Al2O3 composites by the laser-flash method from room temperature to 350 were firstly measured. Results showed with an increasing content of fillers, the TC of CACAl2O3 will increase accordinglyIt also illustrated that calcium aluminate cement was a high thermal stable encapsulation material with thermal conductivity over epoxy resins. Then, the Finite Element Model (FEM) was established and calibrated by experimental data for thermal conductivity simulation. The FEM model accuracy reached 90%. Such models for new filler materials are effective to minimize material development by actual experiments and characterizations, for CAC composite with different fillers. It also provides an alternative method in predicting other physical properties of composites such as coefficient of thermal expansion, porosity, etc. |
Keywords | Cement; Electronic packaging; Encapsulation; Finite element modeling; Thermal conductivity |
ANZSRC Field of Research 2020 | 4016. Materials engineering |
Public Notes | Files associated with this item cannot be displayed due to copyright restrictions. |
Funder | Special Project for Research and Development in Key areas of Guangdong Province |
Byline Affiliations | Fudan University, China |
Heraeus Materials Technology Shanghai, China | |
Institute for Life Sciences and the Environment | |
Delft University of Technology, Netherlands |
https://research.usq.edu.au/item/yy354/finite-element-modeling-for-thermal-conductivity-of-cement-based-encapsulation-materials
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