An Investigation into the Failure Characteristics of External PCB Traces with Different Angle Bends

Article


Elliot, Jake and Brown, Jason. 2023. "An Investigation into the Failure Characteristics of External PCB Traces with Different Angle Bends ." Journal of Electronic Testing: theory and applications. 39 (1), pp. 103-110. https://doi.org/10.1007/s10836-023-06043-0
Article Title

An Investigation into the Failure Characteristics of External PCB Traces with Different Angle Bends

ERA Journal ID4596
Article CategoryArticle
AuthorsElliot, Jake and Brown, Jason
Journal TitleJournal of Electronic Testing: theory and applications
Journal Citation39 (1), pp. 103-110
Number of Pages8
Year2023
Place of PublicationUnited States
ISSN0923-8174
1573-0727
Digital Object Identifier (DOI)https://doi.org/10.1007/s10836-023-06043-0
Web Address (URL)https://link.springer.com/article/10.1007/s10836-023-06043-0
Abstract

The design of a Printed Circuit Board (PCB) involves satisfying numerous design constraints in terms of the positioning of components and the routing of conducting tracks or traces between components. One common design constraint is limiting the maximum angular bend that a trace can make (e.g. to 45°) for several potential reasons including reliability. In this paper, we systematically investigate the failure characteristics of PCB external traces with different angle bends to understand the implications in a modern context with modern PCB manufacturing processes. This involves destructive testing of straight traces with no bends, traces with only 45° bends and traces with only 90° bends. There are three aspects to the testing: (1) maximal current testing, in which the maximum current that a trace can withstand before failure is measured, (2) failure location testing for traces with bends i.e. trace failed on straight segment or at the bend, and (3) time to failure testing. We did not find a large difference between the maximum currents that can be withstood by straight traces, traces with 45° bends and traces with 90° bends. However, some of the interesting results are that traces with 45° bends are significantly more likely to fail at the location of a bend than traces with 90° bends, and straight traces take much longer to fail on average than traces with bends for a given test current.

KeywordsPCB (Printed Circuit Board), Reliability, Design rules
Article Publishing Charge (APC) Amount Paid0.0
Article Publishing Charge (APC) FundingResearcher
Contains Sensitive ContentDoes not contain sensitive content
ANZSRC Field of Research 2020400904. Electronic device and system performance evaluation, testing and simulation
400802. Electrical circuits and systems
Byline AffiliationsSchool of Engineering
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