Numerical Study of a Wickless Heat Pipe for Cooling of Electronic Component

Numerical Study of a Wickless Heat Pipe for Cooling of Electronic Component

This work conducts a numerical analysis on a wickless heat pipe with a flat evaporator (100 mm × 100 mm × 30 mm) designed to cool electronic components. A flat square electrical element of 100 mm × 100 mm is used to generate heat. The objective is to examine the relationship between the thermal performance of wickless heat pipe, its fill ratio, and the flow rate of cooling water. Performance was validated using Engineering Equation Solver (EES) software. Various fill ratios (15%, 25%, 50%, and 85%) and input powers (10 W to 100 W) were considered, with flow rates of cooling water ranging 0.0083 kg/s - 0.033 kg/s. The results indicate that at 100 W input power and a 15% fill ratio, the evaporator wall temperature reached 100℃. The minimum evaporator resistance of 0.07℃/W and condenser resistance of 0.14℃/W were observed at a 50% fill ratio under similar conditions. The optimal cooling water flow rate for this system was found to be 0.016 kg/s.