Characterisation of chip-on-board (COB) encapsulate epoxies used in the printed circuit board assembly (PCBA) industry using variable frequency microwave (VFM) facilities
Paper
Paper/Presentation Title | Characterisation of chip-on-board (COB) encapsulate epoxies used in the printed circuit board assembly (PCBA) industry using variable frequency microwave (VFM) facilities |
---|---|
Presentation Type | Paper |
Authors | Ku, H. S. (Author), Siu, F. (Author), Mok, P. L. (Author), Siores, E. (Author) and Ball, J. A. R. (Author) |
Editors | Wong, S. V., Osman, M. R., Yusuff, R. M. and Ismail, N. |
Journal or Proceedings Title | Proceedings of 2nd World Engineering Congress (WEC 2002) |
Number of Pages | 7 |
Year | 2002 |
Place of Publication | Selangor Darul Ehsan, Malaysia |
ISBN | 9679601358 |
Conference/Event | 2nd World Engineering Congress (WEC 2002) |
Event Details | 2nd World Engineering Congress (WEC 2002) Event Date 22 to end of 25 Jul 2002 Event Location Sarawak, Malaysia |
Abstract | In the printed circuit board assembly (PCBA) industry, integrated circuit (IC) dies are attached onto the printed circuit board (PCB) with epoxy. The die pads are first connected to the PCB tracks with gold or aluminium wires, utilising an ultrasonic wire-bonding machine. The dies are then coated with thermally cured epoxy. The chip-on-board (COB) is finally placed in an electrical oven for baking at certain temperature for a certain period of time, depending upon the type of epoxy used, until the adhesive is completely cured. The baking process using an electrical oven is time-consuming and costly. An alternative way of curing the epoxy is desirable searched. A variable frequency microwave (VFM) source is identified as the possible solution. The first step in curing the epoxy using VFM heating is to find out the best frequency to process the materials in microwaves and this is termed as 'characterisation' of the epoxy by the VFM oven manufacturers. Two VFM facilities were employed to perform the characterisation. One is in the frequency range of 2–8 GHz and the other is in the frequency range of 6.5–18 GHz. By using these two facilities, the best frequency range to process an epoxy by VFM can be identified. Two high quality and commonly epoxy resins, Uniset adhesive and Hysol encapsulant were chosen for consideration. The two resins were then characterised by VFM facilities. From the graphs of the characterisation, a better resin of the two can be identified. |
Keywords | printed circuit board assembly industry; chip-on-board; encapsulate epoxies; variable frequency microwave facilities |
ANZSRC Field of Research 2020 | 401699. Materials engineering not elsewhere classified |
401499. Manufacturing engineering not elsewhere classified | |
400999. Electronics, sensors and digital hardware not elsewhere classified | |
Public Notes | © 2002 WEC. No evidence of copyright restrictions. |
Byline Affiliations | Department of Mechanical and Mechatronic Engineering |
Swinburne University of Technology | |
Approach Industries Hong Kong, China | |
Department of Electrical, Electronic and Computer Engineering |
https://research.usq.edu.au/item/9y283/characterisation-of-chip-on-board-cob-encapsulate-epoxies-used-in-the-printed-circuit-board-assembly-pcba-industry-using-variable-frequency-microwave-vfm-facilities
Download files
3252
total views942
total downloads4
views this month2
downloads this month