A pilot study on the relationship between mechanical and electrical loss tangents of glass powder reinforced epoxy composites post-cured in microwaves
Paper
Paper/Presentation Title | A pilot study on the relationship between mechanical and electrical loss tangents of glass powder reinforced epoxy composites post-cured in microwaves |
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Presentation Type | Paper |
Authors | Ku, H. (Author), Wong, P. (Author), Maxwell, A. (Author), Huang, J. (Author), Fung, H. (Author) and Mohan, T. (Author) |
Editors | Zhu, Zeng |
Journal or Proceedings Title | Advanced Materials Research |
Journal Citation | 214, pp. 26-30 |
Number of Pages | 5 |
Year | 2011 |
Place of Publication | Zurich, Switzerland |
ISSN | 1022-6680 |
1662-8985 | |
Digital Object Identifier (DOI) | https://doi.org/10.4028/www.scientific.net/AMR.214.26 |
Web Address (URL) of Paper | http://www.scientific.net/AMR.214.26 |
Conference/Event | ICKEM 2011: 1st International Conference on Key Engineering Materials |
Event Details | ICKEM 2011: 1st International Conference on Key Engineering Materials Event Date 25 to end of 27 Mar 2011 Event Location Sanya, China |
Abstract | The mechanical and thermal properties of hollow glass powder reinforced epoxy resin composites have been measured and evaluated in earlier studies. This basic but critical and important data have caused interests in the relevant industry in Australia. This study is therefore carried out to measure and evaluate the dielectric properties of the composites with a view to benefit the relevant industry. The relationship between the dielectric and thermal properties will also be studied and correlated. The original contributions of this paper are that samples post-cured in conventional ovens have higher electrical as well as mechanical loss tangent values than their counterparts cured in microwaves only. The storage modulus of all samples post-cured conventionally is higher than its counterpart. This is in line with the fact that they are softer material with lower glass transition temperatures. For all percentages by weight of glass powder, the glass transition temperature for the microwave cured sample was higher and the composite was stiffer; the opposite was true for the conventionally cured samples. |
Keywords | epoxy resin hollow glass powder; dielectric loss tangent; mechanical loss tangent; glass transition temperature; storage modulus |
ANZSRC Field of Research 2020 | 401699. Materials engineering not elsewhere classified |
401205. Experimental methods in fluid flow, heat and mass transfer | |
401609. Polymers and plastics | |
Public Notes | File reproduced in accordance with the copyright policy of the publisher/author. |
Byline Affiliations | Centre of Excellence in Engineered Fibre Composites |
Department of Electrical, Electronic and Computer Engineering | |
Faculty of Engineering and Surveying | |
Institution of Origin | University of Southern Queensland |
https://research.usq.edu.au/item/q09wz/a-pilot-study-on-the-relationship-between-mechanical-and-electrical-loss-tangents-of-glass-powder-reinforced-epoxy-composites-post-cured-in-microwaves
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