Effects of indium addition on properties and wettability of Sn–0.7Cu–0.2Ni lead-free solders
Article
Article Title | Effects of indium addition on properties and wettability of Sn–0.7Cu–0.2Ni lead-free solders |
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ERA Journal ID | 4961 |
Article Category | Article |
Authors | Li, L. F. (Author), Cheng, Y. K. (Author), Xu, G. L. (Author), Wang, E. Z. (Author), Zhang, Z. H. (Author) and Wang, H. (Author) |
Journal Title | Materials and Design |
Journal Citation | 64, pp. 15-20 |
Number of Pages | 6 |
Year | 2014 |
Publisher | Elsevier |
Place of Publication | London, United Kingdom |
ISSN | 0261-3069 |
0264-1275 | |
1873-4197 | |
Digital Object Identifier (DOI) | https://doi.org/10.1016/j.matdes.2014.07.035 |
Web Address (URL) | http://www.sciencedirect.com/science/article/pii/S0261306914005676 |
Abstract | This paper reports the investigation on indium addition into Sn–0.7Cu–0.2Ni lead-free solder to improve its various performances. The effects of indium addition on melting temperature, coefficient of thermal expansion (CTE), wettability, corrosion resistance and hardness of the solder alloys were studied. The results showed that when the addition of indium was ⩽0.3 wt.%, the change in melting temperature of Sn–0.7Cu–0.2Ni–xIn solders was negligible, but the melting range of the solder alloy increased. The CTE and spreading area of Sn–0.7Cu–0.2Ni–xIn solders on copper both increased with the addition of indium. An optimal CTE was 17.5 × 10−6/°C by adding 0.3 wt.% indium. At this concentration, the spreading area of solder on copper was about 15.6% larger than that of Sn–0.7Cu–0.2Ni indium-free solder. The corrosion resistance also increased with the addition of indium increasing, and the corrosion rate of Sn–0.7Cu–0.2Ni–0.3In solder was reduced by 32.8% compared with Sn–0.7Cu–0.2Ni alloy after 14 days in 5% hydrochloric acid solution at room temperature. However, a decrease of 11.7% in hardness of the solder was found when 0.3 wt.% indium was added. |
Keywords | lead-free solder; melting property; wettability; mechanical properties |
ANZSRC Field of Research 2020 | 400505. Construction materials |
340602. Chemical thermodynamics and energetics | |
401607. Metals and alloy materials | |
Public Notes | Files associated with this item cannot be displayed due to copyright restrictions. |
Byline Affiliations | Centre of Excellence in Engineered Fibre Composites |
Southwest University of Science and Technology, China | |
Institution of Origin | University of Southern Queensland |
https://research.usq.edu.au/item/q2q1v/effects-of-indium-addition-on-properties-and-wettability-of-sn-0-7cu-0-2ni-lead-free-solders
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