Engineering Stress in Thin Films: An Innovative Pathway Toward 3D Micro and Nanosystems
Article
Article Title | Engineering Stress in Thin Films: An Innovative Pathway Toward 3D Micro and Nanosystems |
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ERA Journal ID | 3432 |
Article Category | Article |
Authors | Truong, Thanh-An (Author), Nguyen, Tuan-Khoa (Author), Zhao, Hangbo (Author), Nguyen, Nhat-Khuong (Author), Dinh, Toan (Author), Park, Yoonseok (Author), Nguyen, Thanh (Author), Yamauchi, Yusuke (Author), Nguyen, Nam-Trung (Author) and Phan, Hoang-Phuong (Author) |
Journal Title | Small |
Journal Citation | 18 (4), pp. 1-29 |
Article Number | 2105748 |
Number of Pages | 29 |
Year | 2022 |
Publisher | John Wiley & Sons |
Place of Publication | Germany |
ISSN | 1613-6810 |
1613-6829 | |
Digital Object Identifier (DOI) | https://doi.org/10.1002/smll.202105748 |
Web Address (URL) | https://onlinelibrary.wiley.com/doi/full/10.1002/smll.202105748 |
Abstract | Transformation of conventional 2D platforms into unusual 3D configu-rations provides exciting opportunities for sensors, electronics, optical devices, and biological systems. Engineering material properties or control-ling and modulating stresses in thin films to pop-up 3D structures out of standard planar surfaces has been a highly active research topic over the last decade. Implementation of 3D micro and nanoarchitectures enables unprecedented functionalities including multiplexed, monolithic mechanical sensors, vertical integration of electronics components, and recording of neuron activities in 3D organoids. This paper provides an overview on stress engineering approaches to developing 3D functional microsystems. The paper systematically presents the origin of stresses generated in thin films and methods to transform a 2D design into an out-of-plane configu-ration. Different types of 3D micro and nanostructures, along with their applications in several areas are discussed. The paper concludes with cur-rent technical challenges and potential approaches and applications of this fast-growing research direction. |
Keywords | 3d configurations; 3D Structure; Engineering materials; Micro-/nano-3d structure; Micro/nano; Planar surface; Research topics; Sensor electronics; Stress, thin film; Thin-films |
ANZSRC Field of Research 2020 | 401705. Microelectromechanical systems (MEMS) |
Public Notes | Files associated with this item cannot be displayed due to copyright restrictions. |
Byline Affiliations | Griffith University |
University of Southern California, United States | |
Centre for Future Materials | |
Northwestern University, United States | |
University of Queensland | |
Institution of Origin | University of Southern Queensland |
https://research.usq.edu.au/item/q75w5/engineering-stress-in-thin-films-an-innovative-pathway-toward-3d-micro-and-nanosystems
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